|Place of Origin:||China|
|Certification:||ISO13485, IATF16949, ISO9001|
|Minimum Order Quantity:||1PCS|
|Price:||USD 0.1-3/ pcs|
|Packaging Details:||1.Inner: PCB: Vacuum Packing PCBA: ESD Packing 2.Outer: Standard export carton 3.Customized package.|
|Payment Terms:||L/C, D/A, D/P, T/T, Western Union, MoneyGram|
|Service:||One-stop Service||Layer Count:||1-48|
|Testing Service:||Function Test, 100% Test||MOQ:||No MOQ|
|PCBA Test:||X-ray,AOI Test,Functional Test||Solder Mask Color:||Yellow,green,blue,white|
Small Volume Fast PCBA,
Electronic Fast PCBA
1. High-end, Small volume and Various kinds of PCBA service offered.
2. Speedy, Flexible and one-stop service in PCBA.
3. Assembly and Purchasing service offered, all components are promised purchased 100% from Original factories or their pointed agents.
4. Transparent quotation,cost and benefit are detailedly opened to customer.
5. With professional Engineers and Long-term successful experience in cooperating with customers inland and overseas.
all new projects can be developed faster and better than expected.
6. Technical backbone workers have more than 10 years'working experience and 85% of front-line operators have more than 5 years' working experience.
7. With USA or Japan imported tin cream and tin bar, and 100% AOI testing during production, all PCBAs we made are more reliable.
8. Workshops strictly implement 5S production standards.
Specification of PCBA assembly:
|PCBA Type of Assembly||SMT,DIP, Mixed(surface mount and through hole) technology,Cable assembly|
|Solder Type of electronic PCBA||Water Soluble Solder Paste,Leaded and Lead-Free|
|Minimum IC Pitch for OEM PCBA||0.2mm|
|Minimum chip size PCBA board||0201 (0.2x0.1)/0603 (0.6 x 0.3mm)|
|Maximum BGA size SMT Assembly PCBA||74x74mm|
|BGA ball pitch PCBA||1.00mm (minimum),3.00mm (maximum)|
|BGA ball diameter Pcba Assembly||0.40mm (minimum),1.00mm (maximum)|
|Components||BGA and VFBGA|
|Leadless Chip Carriers/CSP|
|Double-sided SMT Assembly pcba|
|Fine Pitch to 0.8mils|
|BGA Repair and Reball|
|As small as 0402 package|
|As small as 0201 with design review|
|Ball Grid Arrays(BGA)|
|As small as .5mm pitch|
|Part Removal and Replacement|
|Bare Board Size||Smallest:0.25*0.25 inches|
|File Formate||Bill of Materials|
|Types of Service||Turn-key,partial turn-key or consignment|
|Component packaging||Cut Tape,Tube,Reels,Loose Parts|
|Turn Time||Same day service to 15 days service|
|Testing||First prototype test before mass quantity production,Flying Probe Test,X-ray Inspection AOI Test,BGA X-ray, PCB E-test|
Contact Person: Della
Address: Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building
Factory Address:Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building