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High Density FR4 CEM3 Pcb Prototype Service Assembly

High Density FR4 CEM3 Pcb Prototype Service Assembly

High Density FR4 CEM3 Pcb Prototype Service Assembly
High Density FR4 CEM3 Pcb Prototype Service Assembly
High Density FR4 CEM3 Pcb Prototype Service Assembly
Product Details:
Place of Origin: China
Brand Name: FASTPCBA
Certification: ISO13485, IATF16949, ISO9001,IOS14001
Model Number: PCB/PCBA Manufacturing
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: PCB: Vacuum Packing / PCBA: ESD Packing
Delivery Time: 1-30 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability: 100000pcs/month
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Detailed Product Description
Name: Printed Circuit Board Assemblies Max Board Size: 1200x500mm
Base Material: FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) Board Outline Tolerance: ±0.15mm
Board Thickness: 0.4mm--3.2mm Minimum Line/space: 0.1mm
Min Hole Size(laser Hole): 0.1mm Copper Weight: 0.5--6oz
High Light:

CEM3 Pcb Prototype Service

,

CEM3 Pcb Prototype Assembly

,

FR4 Pcb Prototype Service

High Density FR4 CEM3 Pcb Prototype Service Assembly

 

High Density Pcb Board Fabrication Printed Circuit Board Assemblies

 

 

OEM Services For PCBA:


· PCBA, PCB Board assembly: SMT & PTH & BGA
· Components sourcing and purchasing
· Quick prototyping
· Plastic injection molding
· Metal sheet stamping
· Final assembly
· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
· Custom clearance for material importing and product exporting
Now we have been a factory which can provide one-stop service, from the PCB production, the components purchasing to the components assemble.

 

High Density FR4 CEM3 Pcb Prototype Service Assembly 0

 

 

Bare PCB Manufacturing and PCB Assembly Service:

Offering: Rigid PCB; Flexible PCB; Rigid-flex PCB; HDI PCB; Gold-Plated PCB; High Frequency PCBs; Aluminum PCB; Copper Base Circuit Board; High TG PCB; Heavy Copper PCB......

 

High Density FR4 CEM3 Pcb Prototype Service Assembly 1

 

Our Production Capacity

 

PCB Item

Manufacture Capacity

Layer Counts

1--48L

Base Material

FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)

Material Thickness(mm)

0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2

Max board size(mm)

1200x500mm

Board Outline Tolerance

±0.15mm

Board Thickness

0.4mm--3.2mm

Thickness Tolerance

±8%

Minimum line/space

0.1mm

Min Annular Ring

0.1mm

SMD Pitch

0.3mm

Holes

 

Min Hole Size(mechanical)

0.2mm

Min Hole Size(laser hole)

0.1mm

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

 

HASL/LF HAL

2.5um

Immersion Gold

Nickel 3-7um Au:1-5u''

Surface Finish

HAL,ENIG,Plated Gold,Immersion Gold,OSP

Copper

 

Copper Weight

0.5--6oz

Color

 

Solder mask

Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue

Silk screen

White, Black, Blue,Yellow

Acceptable File Format

Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000

Certificate

ROSH,ISO9001,UL

 

PCB Assembly Capability

 

Stencil Size

736x736mm

Minimum IC Pitch

0.2mm

Maximum PCB size

1200x 500mm

Minimum PCB thickness

0.25mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Volume:

One piece to low volume production quantities
Low cost first article builds
Schedule deliveries

Assembly type:

Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly

Components type:

Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch

Parts procurements:

Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest

Solder type:

Leaded
Lead-free/ROHS compliant

Other capabilities:

Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.

 

 

PCBA Application:


1, Telecom Communica
2, Security monitor
3, Vehicle Electronices
4, Smart Home
5, Industrial controls
6, Military & Defense
7, Automotive
8, Industrial Automation
9, Medical Devices
10, New Energy
And so on

 

High Density FR4 CEM3 Pcb Prototype Service Assembly 2

 

 

Q1.What is needed for quotation?
A: PCB : Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)

PCBA: PCB information, BOM, (Testing documents...)

 

Q2. What file formats do you accept for production?
A: Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)

 

Q3. Are my files safe?
A: Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third parties.

 

Q4. MOQ?
A: There is no MOQ in FASTPCBA.We are able to handle Small as well as large volume production with flexibility.

 

Q5.Shipping cost?
A: The shipping cost is determined by the destination, weight, packing size of the goods. Please let us know if you need us to quote you the shipping cost.

 

Q6. Do you accept process materials supplied by clients?
A: Yes, we can provide component source, and we also accept component from client.

 

Contact Details
Shenzhen Jingbang Technology Co. , Ltd

Contact Person: Della

Tel: +8618320744730

Send your inquiry directly to us (0 / 3000)

Contact

Address: Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building

Factory Address:Shenzhen Guangming yulv Village Road Jade Spring beauty industrial district 18-1 building