|Turnkey PCBA:||PCB+components Sourcing+assembly+package||Lead Time:||Prototype: 15 Work Days. Mass Order: 20~25 Work Days|
|Testing On Products:||Flying Probe Test, X-ray Inspection, AOI Test, Functional Test||Quantity:||Min Quantity: 1000pcs. Prototype, Small Order, Mass Order, All OK|
|Files We Need:||Assembly: Pick-N-Place File||PCB Panel Size:||Min Size: 0.25*0.25 Inches(6*6mm)，Max Size: 20*20 Inches(500*500mm)|
|Copper Thickness:||1oz,0.5-2.0 Oz,1-3oz,0.5-5oz,0.5-4oz||Base Material:||FR4, Aluminium, TG, Rogers, CEM-1|
diy pcb assembly,
key pcb assembly,
keyboard pcb assembly
One of the main advantages of through-hole parts is their strength. The surface mount parts are soldered to a metal pad, and while this provides a strong bond between the parts and the circuit board, it is not nearly as strong as a through-hole connection. With the through-hole lead through a hole and the solder up and through the core suction, the part has a more robust solder spot. This strength is critical for switches, battery holders, connectors and other interface components that would be under a lot of stress during normal use.
Another through-hole advantage is suitable for designs with large amounts of power. High-current circuits require large and sturdy soldered connections to the circuit board for wiring, and surface-mounted solder points may not be sufficient. In addition, high power components can also be very heavy, especially if radiators are used. Not only do these parts require the strength we mentioned above, but the heat required to weld them into place may be too much for surface mount solder spots. In addition, for the reasons we have just listed, many larger components for high power applications simply cannot be packaged in an equivalent surface mount.
1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.
2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.
Single-side mixed loading process
Incoming material detection => PCB side A screen printing solder paste (spot patch glue) => patch => drying (curing) => reflow welding => cleaning => plug-in => wave soldering => cleaning => detection => repair
Double-sided mixed loading process
A: Incoming material detection =>PCB B spot patch glue => patch => curing => turn over =>PCB A side plug-in => wave soldering => cleaning => detection => repair
Stick before insert, suitable for SMD components more than separate components
B: Incoming material detection => PCB side A plug-in (pin bent) => turn over => PCB side B patch glue => patch => curing => turn over => wave soldering => cleaning => detection => repair
Insert before paste, suitable for separated components more than SMD components
|No.||Types Of Assembly||File Format||Component Footprinr||Component Package||Testing Produres||Produres||Others|
|1||SMT ASSEMBLY||Gerber RS-274X||0201,0402,0603...||Reels Package||Visual Inspection||Lead-Free(Rohs)||Custom Reflow Profile|
|2||SMT & THT Assembly||BOM(.xls,.csv,.xlsx)||BGA,QFN,QFP,PLCC||Cut Tape Package||X-Ray Inspection||Leaded Solder||Standard Reflow Profile|
|3||2 sided SMT,THT Assembly||Pick-N-Place/XY file||SOIC,POP...Connectors||Tube and Tray||AOI,ICT(In-Circuit Test)||Reflow Soldering||Smallest Size:0.2"x0.2"|
|4||Mixed Assembly||...||Small Pitch of 8 Mils||Loose parts and bulk||Functional Testing||Wave Soldering||Largest Size:15"x"20
|Turnkey PCBA||PCB+components sourcing+assembly+package|
|Assembly details||SMT and Thru-hole, ISO lines|
|Lead Time||Prototype: 15 work days. Mass order: 20~25 work days|
|Testing on products||Flying Probe Test, X-ray Inspection, AOI Test, functional test|
|Quantity||Min quantity: 1pcs. Prototype, small order, mass order, all OK|
|Files we need||PCB: Gerber files(CAM, PCB, PCBDOC)|
|Files we need||Components: Bill of Materials(BOM list)|
|Files we need||Assembly: Pick-N-Place file|
|PCB panel Size||Min size: 0.25*0.25 inches(6*6mm)|
|Max size: 20*20 inches(500*500mm)|
|PCB Solder Type||Water Soluble Solder Paste, RoHS lead free|
|Components details||Passive Down to 0201 size|
|Components details||BGA and VFBGA|
|Components details||Leadless Chip Carriers/CSP|
|Components details||Double-sided SMT Assembly|
|Components details||Fine Pitch to 0.8mils|
|Components details||BGA Repair and Reball|
|Components details||Part Removal and Replacement|
|Component package||Cut Tape,Tube,Reels,Loose Parts|
|PCB assembly||Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing|
1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, OEM with 21 years experience.
4. Certifications: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001,IATF16949
Q: What files do you use in PCBA fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position.
Q: Is it possible you could offer sample?
A: Yes, we can custom samples for your testing before mass production.
Q: How much time could I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24 hours for PCBA quotation.
Q: How can I know the process of my PCBA production?
A: 7-10 days for PCB production and components purchasing, and 10 days for PCB assembly and Testing.
Q.What is the warranty?
The warranty is 2years.
Contact Person: Wang