Glue overflow is a common quality abnormal phenomenon in the FPC flexible circuit board pressing process. Glue overflow refers to the fact that the temperature rises during the pressing process, which causes the glue system to flow in the COVERLAY, which leads to the flow of the glue in the FPC flexible circuit board. The problem of glue stains on the PAD position is similar to the EXPORY series. There are many reasons for the overflow of glue on FPC flexible circuit boards, so we should propose different solutions according to the specific situation.

1. The glue overflow is caused by the manufacturing process of COVERLAY

Then, FPC flexible circuit board manufacturers should strictly inspect incoming materials. If the overflow of glue exceeds the standard during the sampling inspection of incoming materials, contact the supplier to return and exchange the goods, otherwise it is difficult to control the overflow of glue in the production process.

2. The spilled glue is caused by the storage environment

FPC flexible circuit board manufacturers are best to build a special freezer to store the protective film. If the CL glue system is damp due to the storage conditions not meeting the requirements, the CL can be pre-baked at low temperature to greatly improve the amount of CL overflow. In addition, the CL that has not been used up that day needs to be returned to the freezer for storage in time.

3. Local overflow caused by independent small PAD positions

This phenomenon is one of the most common quality abnormalities encountered by most domestic FPC flexible circuit board manufacturers. If the process parameters are changed simply to solve the overflow of glue, it will bring new problems such as bubbles or insufficient peel strength. Can reasonably adjust the process parameters.

4. Glue overflow caused by operation method

When the FPC flexible circuit board is falsely connected, it is necessary to require the employees to accurately align the alignment, correct the alignment fixture, and increase the alignment inspection force to avoid overflow due to inaccurate alignment. At the same time, do the "5S" work during the pressing and false connection, and check whether the protective film CL is contaminated and whether there are burrs before alignment.

5. Glue overflow caused by the process of FPC flexible circuit board factory

If a fast press is used for pressing, then appropriately extending the pre-pressing time, reducing the pressure, lowering the temperature, and reducing the pressing time will help reduce the amount of glue overflow. If the pressure of the press is uneven, you can use induction paper to test whether the pressure of the press is uniform, and you can contact the supplier of the fast press to debug the equipment.