HDI PCB (High Density Interconnect PCB) is a relatively high line distribution density of circuit boards using microblind and buried via technology.

This is a process that includes inner and outer wires, and then uses holes and metallization in the holes to achieve the function of joining each inner layer.

With the development of high-density and high-precision electronic products, the requirements for circuit boards are also the same. The most effective way to increase PCB density is to reduce the number of through holes, and accurately set blind and buried holes to meet this requirement, thereby generating HDI boards.

HDI: High-density interconnection technology. It is a multilayer board made of stacking method and micro-blind buried vias.

Microvia: In the PCB, a hole with a diameter of less than 6 mils (150μm) is called a buried hole: it is buried in the inner layer of the hole and is not visible in the finished product. It is mainly used for the conduction of the inner line and can reduce signal interference. Probability, and maintain the continuity of the characteristic impedance of the transmission line. Since the buried vias do not occupy the surface area of the PCB, more components can be placed on the surface of the PCB.

Blind hole: Connect the surface layer and the inner layer without passing through a complete-through hole.