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Product Details:
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| Layers: | 1-28 | Color: | Green, Customized Color, Blue On Your Request |
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| Material: | FR-4 | Application: | Electronics Device, Consumer Electronics, Electronical Products, Industrial, And So On |
| Service: | One-stop Service, PCB&PCBA, ODM And OEM | Board Thickness: | 1.6mm, 0.5~3.2mm, 0.2-3.0mm, 0.3~2.5mm, 2.0mm |
| High Light: | FR4 Pcb Assembly,electronic pcba,pcba printed circuit board assembly |
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Our Advantages:
1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, OEM with 21 years experience.
4. Certifications: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001,IATF16949
SMT
The components will be mounted on the circuit board through SMT mounter, and online AOI automatic optical detection will be carried out if
necessary. After testing, the perfect reflow furnace temperature curve is set to let the circuit board flow through reflow welding.
DIP
1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.
2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.
| Turnkey PCBA | PCB+components sourcing+assembly+package | ||||
| Assembly details | SMT and Thru-hole, ISO lines | ||||
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days | ||||
| Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test | ||||
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK | ||||
| Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) | ||||
| Files we need | Components: Bill of Materials(BOM list) | ||||
| Files we need | Assembly: Pick-N-Place file | ||||
| PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) | ||||
| Max size: 20*20 inches(500*500mm) | |||||
| PCB Solder Type | Water Soluble Solder Paste, RoHS lead free | ||||
| Components details | Passive Down to 0201 size | ||||
| Components details | BGA and VFBGA | ||||
| Components details | Leadless Chip Carriers/CSP | ||||
| Components details | Double-sided SMT Assembly | ||||
| Components details | Fine Pitch to 0.8mils | ||||
| Components details | BGA Repair and Reball | ||||
| Components details | Part Removal and Replacement | ||||
| Component package | Cut Tape,Tube,Reels,Loose Parts | ||||
| PCB assembly | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing | ||||
Contact Person: Wang
Tel: 18006481509
