Product Details:
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Min. Line Width: | 3mi, 4mil, 0.1mm, 0.1mm(Flash Gold)/0.15mm(HASL), 0.1 0mm | Surface Finishing: | HASL, OSP, ENIG, HASL Lead Free, Immersion Gold |
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Copper Thickness: | 1oz,0.5-2.0 Oz,1-3oz,0.5-5oz,0.5-4oz | Base Material: | FR4, Aluminium, TG, Rogers, CEM-1 |
Min. Line Spacing: | 0.003", 4mil, 0.2mm, 0.15mm, 0.1mm4mil) | Board Thickness: | 1.6mm, 0.5~3.2mm, 0.2-3.0mm, 0.3~2.5mm, 2.0m |
Min. Hole Size: | 0.25mm, 0.1mm, 0.2 Mm, 0.15-0.2mm, 0.1mm-1mm | Solder Mask: | Blue, Green. Red. Blue. White. Black.Yellow |
High Light: | pcba company,electronic pcb assembly,Multi layer PCB Assembly |
SMT
SMT patch processing will purchase components according to BOM, BOM provided by customers and confirm the PMC plan of production. After the preparatory work is completed, we will start SMT programming, manufacture laser steel mesh and solder paste printing according to the SMT process.
The components will be mounted on the circuit board through SMT mounter, and online AOI automatic optical detection will be carried out if necessary. After testing, the perfect reflow furnace temperature curve is set to let the circuit board flow through reflow welding.
After the necessary IPQC inspection, the DIP material can then be passed through the circuit board using the DIP process and then through wave soldering. Then it is time to carry out the necessary post-furnace process.
Turnkey PCBA | PCB+components sourcing+assembly+package | ||||
Assembly details | SMT and Thru-hole, ISO lines | ||||
Lead Time | Prototype: 15 work days. Mass order: 20~25 work days | ||||
Testing on products | Flying Probe Test, X-ray Inspection, AOI Test, functional test | ||||
Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK | ||||
Files we need | PCB: Gerber files(CAM, PCB, PCBDOC) | ||||
Files we need | Components: Bill of Materials(BOM list) | ||||
Files we need | Assembly: Pick-N-Place file | ||||
PCB panel Size | Min size: 0.25*0.25 inches(6*6mm) | ||||
Max size: 20*20 inches(500*500mm) | |||||
PCB Solder Type | Water Soluble Solder Paste, RoHS lead free | ||||
Components details | Passive Down to 0201 size | ||||
Components details | BGA and VFBGA | ||||
Components details | Leadless Chip Carriers/CSP | ||||
Components details | Double-sided SMT Assembly | ||||
Components details | Fine Pitch to 0.8mils | ||||
Components details | BGA Repair and Reball | ||||
Components details | Part Removal and Replacement | ||||
Component package | Cut Tape,Tube,Reels,Loose Parts | ||||
PCB assembly | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
1. Program and functional test and package by Free.
2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test.
3. Professional service: PCB/FPC/Aluminium Making, SMT, DIP, Component Sourcing, OEM with 21 years experience.
4. Certifications: UL, 94v-0, CE, SGS, FCC, RoHS, ISO9001, ISO14001,IATF16949
Contact Person: Wang
Tel: 18006481509