|Material:||FR-4||Color:||Green, Customized Color, Blue On Your Request|
|Copper Thickness:||1oz,0.5-2.0 Oz,1-3oz,0.5-5oz,0.5-4oz||Board Thickness:||1.6mm, 0.5~3.2mm, 0.2-3.0mm, 0.3~2.5mm, 2.0mm|
|Min. Line Width:||3mi, 4mil, 0.1mm, 0.1mm(Flash Gold)/0.15mm(HASL), 0.1 0mm||Application:||Electronics Device, Consumer Electronics, Electronical Products, Industrial, And So On|
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SMT Technological advantage:
1. High speed universal integrated mounting head, no need to replace the mounting head, can correspond to 0201mm~ large components
2. High speed mounting, 95000CPH per hour
3. Can correspond to large substrate L810*W742mm
4. Maximum number of feeder 140 (fixed specification/convert with 8mm tape feeder)
SMT patch processing will purchase components according to BOM, BOM provided by customers and confirm the PMC plan of production. After the preparatory work is completed, we will start SMT programming, manufacture laser steel mesh and solder paste printing according to the SMT process.
The components will be mounted on the circuit board through SMT mounter, and online AOI automatic optical detection will be carried out if necessary. After testing, the perfect reflow furnace temperature curve is set to let the circuit board flow through reflow welding.
After the necessary IPQC inspection, the DIP material can then be passed through the circuit board using the DIP process and then through wave soldering. Then it is time to carry out the necessary post-furnace process.
After all the above processes are completed, QA will conduct a comprehensive test to ensure product quality.
1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.
2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.
What we need:
* Gerber files of the bare PCB
* Bill of materials to include: Manufacturer's part number, type of part, type of packaging,
component locations listed by reference designators and quantity
* Dimensional specifications for non-standard components
* Assembly drawing, including any change notices
* Final test procedures (if available)
|Copper Thickness||1oz~3oz,0.5-5 Oz||Base Material||FR4, Aluminium, TG, Rogers, CEM-1|
|Board Thickness||1.6mm, 0.5~3.2mm, 0.2-3.0mm, 0.3~2.5mm, 2.0mm||Min. Line Width||3mi, 4mil, 0.1mm, 0.1mm(Flash Gold)/0.15mm(HASL), 0.1 0mm|
|Min. Hole Size||0.25mm, 0.1mm, 0.2 Mm, 0.15-0.2mm, 0.1mm-1mm||Surface Finishing||HASL, OSP, ENIG, HASL Lead Free, Immersion Gold|
|Min. Line Spacing||0.003", 4mil, 0.2mm, 0.15mm, 0.1mm4mil)||Product Name||Printed Circuit Board, 94V0 PCB Design / PCB Manufacturing|
|Application||Electronics Device, Consumer Electronics, Electronical Products, Industrial, And So On||Solder Mask||Blue, Green. Red. Blue. White. Black.Yellow, Green/black/white/red/blue Etc.,|
|Layer||1~20 Layers, 1-24layers||Rohs||Lead free|
|Turnkey PCBA||PCB+components sourcing+assembly+package|
|Assembly details||SMT and Thru-hole, ISO lines|
|Lead Time||Prototype: 15 work days. Mass order: 20~25 work days|
|Testing on products||Flying Probe Test, X-ray Inspection, AOI Test, functional test|
|Quantity||Min quantity: 1pcs. Prototype, small order, mass order, all OK|
|Files we need||PCB: Gerber files(CAM, PCB, PCBDOC)|
|Files we need||Components: Bill of Materials(BOM list)|
|Files we need||Assembly: Pick-N-Place file|
|PCB panel Size||Min size: 0.25*0.25 inches(6*6mm)|
|Max size: 20*20 inches(500*500mm)|
|PCB Solder Type||Water Soluble Solder Paste, RoHS lead free|
|Components details||Passive Down to 0201 size|
|Components details||BGA and VFBGA|
|Components details||Leadless Chip Carriers/CSP|
|Components details||Double-sided SMT Assembly|
|Components details||Fine Pitch to 0.8mils|
|Components details||BGA Repair and Reball|
|Components details||Part Removal and Replacement|
|Component package||Cut Tape,Tube,Reels,Loose Parts|
|PCB assembly||Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing|
Q: What files do you use in PCBA fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position.
Q: Is it possible you could offer sample?
A: Yes, we can custom samples for your testing before mass production.
Q: How much time could I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6 hours for PCB quotation and around 24 hours for PCBA quotation.
Q: How can I know the process of my PCBA production?
A: 7-10 days for PCB production and components purchasing, and 10 days for PCB assembly and Testing.
Q. Are my design secure when I send them to you?
Your files are held in complete safety and security while Kerongda is in possession of them.Your files are never shared with any third parties,only our colleagues have access to your design files.Since they are your property,we respect the copyright of your files.The customer controls the disposition of these files per your requirements and written approval.
Q.What is the warranty?
The warranty is 2years.
Contact Person: Wang