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Surface Mount Pcb Components Smd Board Assembly Pcb Smt Process X Ray Inspection

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Surface Mount Pcb Components Smd Board Assembly Pcb Smt Process X Ray Inspection

Surface Mount Pcb Components Smd Board Assembly Pcb Smt Process X Ray Inspection
Surface Mount Pcb Components Smd Board Assembly Pcb Smt Process X Ray Inspection

Large Image :  Surface Mount Pcb Components Smd Board Assembly Pcb Smt Process X Ray Inspection

Product Details:
Place of Origin: Qingdao China
Brand Name: kerongda
Certification: CE
Model Number: KRD-SMT309
Payment & Shipping Terms:
Minimum Order Quantity: 1k
Price: USD0.01~0.1/dot
Packaging Details: Standard packet
Delivery Time: 15 days
Payment Terms: L/C, T/T
Supply Ability: 40000dot/h

Surface Mount Pcb Components Smd Board Assembly Pcb Smt Process X Ray Inspection

Description
Copper Thickness: 1oz,0.5-2.0 Oz,1-3oz,0.5-5oz,0.5-4oz Min. Line Width: 3mi, 4mil, 0.1mm, 0.1mm(Flash Gold)/0.15mm(HASL), 0.1 0mm
Min. Hole Size: 0.25mm, 0.1mm, 0.2 Mm, 0.15-0.2mm, 0.1mm-1mm Surface Finishing: HASL, OSP, ENIG, HASL Lead Free, Immersion Gold
Application: Electronics Device, Consumer Electronics, Electronical Products, Industrial, And So On Layers: 1-58layers, 1-32, 1-48
Solder Mask: Blue, Green. Red. Blue. White. Black.Yellow Item: ODM OEM LED PCBA, 2 Layer Pcb, Keyboard Pcb Assembly, Custom Circuit Board
High Light:

Surface Mount Pcb Components

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HASL Smd Board Assembly

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CE Smd Board Assembly

SMT Pcb Assembly/Dip/Oem pcba/Kerongda/Smt Control pcb/Multilayer board

 

SMT basic process elements include: screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, testing, repair

1. Screen printing: Its function is to leak solder paste or patch glue onto the PCB pad to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), located at the front end of the SMT line.

2, dispensing: it is to drop the glue to the fixed position of the PCB board, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.

3. Mounting: Its function is to accurately install the surface assembly components to the fixed position of PCB. The equipment used is the SMT machine, which is located behind the screen printing machine in the SMT production line.

4, curing: its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing furnace, which is located behind the SMT machine in the SMT line.

5, reflow welding: its role is to melt the welding paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is reflow furnace, which is located behind the SMT machine in the SMT line.

6, cleaning: its role is to assemble the PCB board above the welding residue harmful to human health, such as flux, etc., to remove. The equipment used is a cleaning machine, the position can not be fixed, can be online or not online.

7, detection: its role is to assemble the PCB board welding quality and assembly quality detection. The equipment used includes magnifying glass, microscope, online tester (ICT), flying needle tester, automatic optical testing (AOI), X-RAY testing system, function tester, etc. Location According to the need of detection, can be configured in the production line of the appropriate place.

8, repair: its role is to detect the fault of the PCB board rework. The tools used are soldering iron, repair workstation, etc. Configuration anywhere in the production line.

 

Single-side mixed loading process

 

Incoming material detection => PCB side A screen printing solder paste (spot patch glue) => patch => drying (curing) => reflow welding => cleaning => plug-in => wave soldering => cleaning => detection => repair

Double-sided mixed loading process

A: Incoming material detection =>PCB B spot patch glue => patch => curing => turn over =>PCB A side plug-in => wave soldering => cleaning => detection => repair

Stick before insert, suitable for SMD components more than separate components

B: Incoming material detection => PCB side A plug-in (pin bent) => turn over => PCB side B patch glue => patch => curing => turn over => wave soldering => cleaning => detection => repair

Insert before paste, suitable for separated components more than SMD components

 

SMT basic process

 

SMT basic process elements include: screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, testing, repair

1. Screen printing: Its function is to leak solder paste or patch glue onto the PCB pad to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), located at the front end of the SMT line.

2, dispensing: it is to drop the glue to the fixed position of the PCB board, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.

 

 

DIP

 

1,The process of DIP processing is: putting in the hole →AOI→ wave soldering → cutting pin →AOI→ correction → washing → quality inspection.

 

2,After wave soldering, The products will be will scanned by AOI equipment to ensure that no error occurs.

 

 

Turnkey PCBA PCB+components sourcing+assembly+package
Assembly details SMT and Thru-hole, ISO lines
Lead Time Prototype: 15 work days. Mass order: 20~25 work days
Testing on products Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need PCB: Gerber files(CAM, PCB, PCBDOC)
Files we need Components: Bill of Materials(BOM list)
Files we need Assembly: Pick-N-Place file
PCB panel Size Min size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder Type Water Soluble Solder Paste, RoHS lead free
Components details Passive Down to 0201 size
Components details BGA and VFBGA
Components details Leadless Chip Carriers/CSP
Components details Double-sided SMT Assembly
Components details Fine Pitch to 0.8mils
Components details BGA Repair and Reball
Components details Part Removal and Replacement
Component package Cut Tape,Tube,Reels,Loose Parts
PCB assembly Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Q&A

Q: What files do you use in PCBA fabrication?

A: Gerber or Eagle, BOM listing, PNP and Components Position.

Q: Is it possible you could offer sample?

A: Yes, we can custom samples for your testing before mass production.

Q: How much time could I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6 hours for PCB quotation and around 24 hours for PCBA quotation.

Q: How can I know the process of my PCBA production?

A: 7-10 days for PCB production and components purchasing, and 10 days for PCB assembly and Testing.

Q. Are my design secure when I send them to you?

Your files are held in complete safety and security while Kerongda is in possession of them.Your files are never shared with any third parties,only our colleagues have access to your design files.Since they are your property,we respect the copyright of your files.The customer controls the disposition of these files per your requirements and written approval.

Q.What is the warranty?

The warranty is 2years.
 
 
 
 
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Contact Details
Qingdao Kerongda Tech Co.,Ltd.

Contact Person: Wang

Tel: 18006481509

Send your inquiry directly to us (0 / 3000)